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1st Runner-Up and Kyushu Keisokki Co., Ltd. Award at the 29th LSI Design Contest

We are delighted to share that our team (M1 Hanyu, M1 Atharv, and B3 Komatsuzaki) received the 1st Runner-Up Prize (Kyushu Keisokki Co., Ltd. Award) at the 29th LSI Design Contest, held in Okinawa, Japan.

Innovation Japan 2025 - University Fair

ใ€ๅ‡บๅฑ•ๅ ฑๅ‘Šใ€‘Innovation Japan 2025 ๏ฝžๅคงๅญฆ่ฆ‹ๆœฌๅธ‚๏ฝž ใซๅ‡บๅฑ•ใ—ใพใ—ใŸ๏ผ๏ผˆใƒ–ใƒผใ‚น็•ชๅท๏ผšI-06๏ผ‰ / Exhibition Report: We Participated in Innovation Japan 2025 โ€“ The University Fair (Booth I-06)!

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We published our material here!

Innovation Japan Banner

็งใŸใกใฏใ€ใ€ŒInnovation Japan ๏ฝžๅคงๅญฆ่ฆ‹ๆœฌๅธ‚๏ฝž 2025ใ€ ใซๅ‡บๅฑ•ใ„ใŸใ—ใพใ—ใŸ๏ผ ใ“ใฎใ‚คใƒ™ใƒณใƒˆใฏใ€ๅคงๅญฆใจไผๆฅญใฎ้€ฃๆบใ‚’ไฟƒ้€ฒใ™ใ‚‹ๆ—ฅๆœฌๆœ€ๅคง็ดšใฎ็”ฃๅญฆ้€ฃๆบๅฑ•็คบไผšใงใ‚ใ‚Šใ€ๆœ€ๅ…ˆ็ซฏใฎ็ ”็ฉถๆˆๆžœใจ็›ดๆŽฅ่งฆใ‚Œๅˆใˆใ‚‹่ฒด้‡ใชๆฉŸไผšใงใ™ใ€‚ ไปŠๅ›žใฎๅ‡บๅฑ•ใซใ‚ใŸใ‚Šใ€ๅคงๅญฆ่ทๅ“กใฎ็š†ใ•ใพใ€ๅฑ•็คบไผš้‹ๅ–ถใƒใƒผใƒ ใฎ็š†ใ•ใพใ€ใใ—ใฆใ”ๆฅๅ ดใ„ใŸใ ใ„ใŸ็š†ใ•ใพใซๅฟƒใ‚ˆใ‚Šๆ„Ÿ่ฌ็”ณใ—ไธŠใ’ใพใ™ใ€‚

We are pleased to share that we already participated in โ€œInnovation Japan โ€“ The University Fair 2025โ€, one of the largest university-industry collaboration events in Japan! It was a wonderful opportunity to showcase our cutting-edge research and directly engage with industry professionals and researchers. We would like to sincerely thank our university staff members, the exhibition organization team, and all the visitors who joined us.

IEEE MCSoC 2023: A Great Experience

Doanh had the opportunity to attend the IEEE 2023 International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC) to present his paper, "A Novel Yield Improvement Approach for 3D Stacking Neuromorphic Architecture." The conference brought together researchers from around the world to discuss developments in multicore and many-core system-on-chip technologies.