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Innovation Japan 2025 - University Fair

【出展報告】Innovation Japan 2025 ～大学見本市～ に出展しました！（ブース番号：I-06） / Exhibition Report: We Participated in Innovation Japan 2025 – The University Fair (Booth I-06)!

私たちは、「Innovation Japan ～大学見本市～ 2025」 に出展いたしました！ このイベントは、大学と企業の連携を促進する日本最大級の産学連携展示会であり、最先端の研究成果と直接触れ合える貴重な機会です。 今回の出展にあたり、大学職員の皆さま、展示会運営チームの皆さま、そしてご来場いただいた皆さまに心より感謝申し上げます。

We are pleased to share that we already participated in “Innovation Japan – The University Fair 2025”, one of the largest university-industry collaboration events in Japan! It was a wonderful opportunity to showcase our cutting-edge research and directly engage with industry professionals and researchers. We would like to sincerely thank our university staff members, the exhibition organization team, and all the visitors who joined us.

Undergraduate Student Presented at ICDV 2024

We’re excited to share that Ryoji Kobayashi さん, now in his 4th year of undergraduate study, presented his first paper at the 2024 9th IEEE International Conference on Integrated Circuits, Design, and Verification (ICDV), held from June 6–8, 2024.

IEEE MCSoC 2023: A Great Experience

Doanh had the opportunity to attend the IEEE 2023 International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC) to present his paper, "A Novel Yield Improvement Approach for 3D Stacking Neuromorphic Architecture." The conference brought together researchers from around the world to discuss developments in multicore and many-core system-on-chip technologies.